Upcoming Webinar | Thursday 30th June, 2.00pm (GMT) | Register Now
This webinar is the third in the Additive Manufacturing series and will present how to integrate multi-scale material solutions. Most materials have complex microstructures that determine their behaviour at the continuum level. To effectively predict that behaviour, we need to understand the effect of the microstructures at different length scales and follow the mechanics that it undergoes at different length scales. For both polymer and for metal AM processes, understanding of the material and its behavior at different length scales is critical in the prediction of residual stresses and part level distortions. For polymers, we will work through a multi-scale workflow starting with the construction and characterization of thermo-plastically cross-linked elastomeric co-polymers to using the material properties to predict their behaviour at the part level. On the metal side, we will showcase how using accurate heat treatment based material models can be used to accurately predict the stress and distortions during the printing. Attendees will hear from both SIMULIA and BIOVIA experts on:
- Designing virtual materials for AM
- Calibrating the properties of the materials to be used in continuum level simulations
- Using the material to predict stress and distortion at part level
- In-service performance of the printed parts using new materials
Engineers, research specialists, material scientists and manufacturing experts working across the Additive Manufacturing supply chain should attend this webinar to learn more about how our simulation solutions can help design virtual material and learn how it will behave for AM applications.
About the Presenter: Subham Sett, Director of SIMULIA Strategic Initiatives
Subham Sett leads a team responsible for developing the simulation strategy and roadmap in several key industry areas including additive manufacturing. In this role he works with the industry, software partners, academia, and regulatory leaders. He has 15 years of engineering simulation experience including structural and multi-physics solutions. He joined SIMULIA in 2003 from Coventor, Inc. where he was a MEMS product development engineer and earned several patents in capacitive switch designs for RF communications. Subham holds a M.S. from the University of Colorado, Boulder, and a B. Tech. from the Indian Institute of Technology, Kharagpur.